Method for providing a redistribution metal layer in an integrated circuit

ABSTRACT

A system and method is disclosed for providing a redistribution metal layer in an integrated circuit. The redistribution metal layer is formed from the last metal layer in the integrated circuit during manufacture of the integrated circuit before final passivation is applied. The last metal layer provides sites for solder bump pads used in flip chip interconnection. The redistribution metal layer can be (1) a flat layer deposited over the next to last metal layer through an opening in a dielectric layer, or (2) deposited over an array of vias connected to the next to last metal layer. Space between the solder bump pads is deposited with narrower traces for connecting active circuit areas below. A final passivation layer is deposited to ensure product reliability.

This application is a division of prior U.S. patent application Ser. No.11/455,503 filed Jun. 19, 2006, now U.S. Pat. No. 7,786,582, which is adivision of prior U.S. patent application Ser. No. 10/091,743 filed Mar.6, 2002, now U.S. Pat. No. 7,096,581.

TECHNICAL FIELD OF THE INVENTION

The present invention is directed, in general, to integrated circuitsand, more specifically, to a system and method for providing aredistribution metal layer in an integrated circuit.

BACKGROUND OF THE INVENTION

Microelectronic devices often use solder projections (also referred toas bumps) in order to establish an electrical connection to othermicroelectronic devices. In a flip chip connection type integratedcircuit, solder bumps are formed on the input/output (I/O) pads, on thetest pads, on the power pads, and on the ground pads of an integratedcircuit chip. The input/output (I/O) pads, the test pads, the powerpads, and the ground pads are collectively referred to as “bump pads.”The face of the chip with the solder bumps is then placed in contactwith a printed circuit board so that the solder bumps are aligned withcorresponding solder pads on the printed circuit board. Heat is appliedto melt the solder bumps and form an electrical connection between thebump pads of the chip and the solder pads of the printed circuit board.

It is often necessary to place a solder bump at a location on a chipthat is not located directly over a corresponding underlying circuit.This is accomplished by adding additional layers to the chip (1) toprovide an electrical connection between the solder bump and acorresponding metal pad, and (2) to provide an additional passivationlayer to insulate the electrical connection between the solder bump andthe corresponding metal pad. This process is generally referred to as“redistribution.” The electrical connection usually comprises a metallayer referred to as a “redistribution metal layer.”

FIG. 1 illustrates a portion of a typical prior art integrated circuitchip 100 showing solder bump 120 attached to and electrically connectedto an “under bump metallurgy” (UBM) layer 130. UBM layer 130 forms abump pad on which solder bump 120 is deposited. UBM layer 130 isattached to and electrically connected to redistribution metal layer140. Redistribution metal layer 140 extends from UBM layer 130 to metalpad 150. Metal pad 150 is used for wire bonding in some cases. Metal pad150 can also be used as an intermediate connecting pad between an activecircuit area and a solder bump pad.

Redistribution metal layer 140 is attached to and electrically connectedto metal pad 150. Metal pad 150 is mounted on silicon layer 160. Activecircuits 170 are also mounted on silicon layer 160. A primarypassivation layer 180 is applied to cover silicon layer 160 and activecircuits 170. A secondary passivation layer 190 is applied to coverredistribution metal layer 140 and primary passivation layer 180.

When integrated circuit chip 100 is manufactured, silicon layer 160 ismanufactured first. Then the active circuits 170 are added. Next metalpad 150 is placed on silicon layer 160. Then primary passivation layer180 is applied to cover silicon layer 160 and metal pad 150 and activecircuits 170. Primary passivation layer 180 is then etched to uncover aportion of metal pad 150.

At this stage the fabrication of the basic functional chip is complete.The next stage is to provide “redistribution” by adding redistributionmetal layer 140, secondary passivation layer 190, and UBM layer 130. Itis common practice to fabricate integrated circuit chip 100 in twostages. In the first stage, the basic functional chip is fabricated. Inthe second stage, the “redistribution” process is performed.

The “redistribution” process is sometimes not performed at the facilitywhere the basic functional chip was fabricated. The “redistribution”process is sometimes subcontracted out to be performed at some otherfacility. In some instances the quality of the “redistribution” processperformed at a subcontractor's facility may not be sufficiently high toqualify the basic functional chip for high reliability applications.

There is therefore a need in the art for an improved system and methodfor providing a high quality “redistribution” process for an integratedcircuit chip. There is also a need in the art for providing a highquality redistribution metal layer in an integrated circuit chip.

SUMMARY OF THE INVENTION

To address the deficiencies of the prior art, it is a primary object ofthe present invention to provide an improved system and method forproviding a redistribution metal layer in an integrated circuit chip.

The present invention generally comprises an improved system and methodfor manufacturing an integrated circuit. In one advantageous embodimentof the present invention an integrated circuit is fabricated by formingan active circuit area and an associated metal pad on a base substrate.A passivation layer is then deposited on the active circuit area and onthe metal pad. Vias are then etched through the passivation layer downto the metal pad. A patterned metal layer is then deposited onto thepassivation layer. This forms a redistribution metal layer. The vias aresimultaneously filled with metal when the redistribution metal layer isdeposited. The vias electrically connect the redistribution metal layerto the metal pad. The redistribution metal layer is then polished toprovide a suitably flat surface that is open to receive a solder bump.

It is an object of the present invention to provide an improved systemand method for providing a high quality “redistribution” process for anintegrated circuit chip.

It is also an object of the present invention to provide an improvedsystem and method for providing a redistribution metal layer in anintegrated circuit chip.

It is another object of the present invention to provide an improvedsystem and method for providing a redistribution metal layer in anintegrated circuit chip that possesses the same quality of manufacturingas other metal layers in the integrated circuit chip.

The foregoing has outlined rather broadly the features and technicaladvantages of the present invention so that those skilled in the art maybetter understand the detailed description of the invention thatfollows. Additional features and advantages of the invention will bedescribed hereinafter that form the subject of the claims of theinvention. Those skilled in the art will appreciate that they mayreadily use the conception and the specific embodiment disclosed as abasis for modifying or designing other structures for carrying out thesame purposes of the present invention. Those skilled in the art willalso realize that such equivalent constructions do not depart from thespirit and scope of the invention in its broadest form.

Before undertaking the DETAILED DESCRIPTION OF THE INVENTION below, itmay be advantageous to set forth definitions of certain words or phrasesused throughout this patent document: the terms “include” and“comprise,” as well as derivatives thereof, mean inclusion withoutlimitation; the term “or” is inclusive, meaning and/or; the phrases“associated with” and “associated therewith,” as well as derivativesthereof, may mean to include, be included within, interconnect with,contain, be contained within, connect to or with, couple to or with, becommunicable with, cooperate with, interleave, juxtapose, be proximateto, be bound to or with, have, have a property of, or the like; and theterm “controller” means any device, system or part thereof that controlsat least one operation, whether such a device is implemented inhardware, firmware, software or some combination of at least two of thesame. It should be noted that the functionality associated with anyparticular controller may be centralized or distributed, whether locallyor remotely. Definitions for certain words and phrases are providedthroughout this patent document, and those of ordinary skill in the artwill understand that such definitions apply in many, if not most,instances to prior uses, as well as to future uses of such defined wordsand phrases.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, wherein likenumbers designate like objects, and in which:

FIG. 1 illustrates a portion of a typical prior art integrated circuitchip that has been fabricated by making a basic functional chip and thenperforming a prior art “redistribution” process to add a redistributionmetal layer, a secondary passivation layer, a UBM layer, and a solderbump to the basic functional chip;

FIG. 2 illustrates an advantageous embodiment of an integrated circuitchip of the present invention;

FIG. 3 illustrates another advantageous embodiment of an integratedcircuit chip of the present invention;

FIG. 4 illustrates a flow chart of an advantageous embodiment of amethod of the present invention for providing a redistribution metallayer in an integrated circuit chip;

FIG. 5 illustrates a first stage of construction of an alternateadvantageous embodiment of an integrated circuit chip of the presentinvention;

FIG. 6 illustrates a second stage of construction of an alternateadvantageous embodiment of an integrated circuit chip of the presentinvention;

FIG. 7 illustrates a third stage of construction of an alternateadvantageous embodiment of an integrated circuit chip of the presentinvention;

FIG. 8 illustrates a flow chart of an advantageous embodiment of amethod of the present invention for providing a redistribution metallayer in an integrated circuit chip; and

FIG. 9 illustrates an advantageous embodiment of an integrated circuitchip of the present invention showing how a last metal layer of theintegrated circuit chip may be used to fabricate a bump pad for a solderbump.

DETAILED DESCRIPTION OF THE INVENTION

FIGS. 1 through 9, discussed below, and the various embodiments used todescribe the principles of the present invention in this patent documentare by way of illustration only and should not be construed in any wayto limit the scope of the invention. Those skilled in the art willunderstand that the principles of the present invention may beimplemented for any suitably arranged integrated circuit.

The system and method of the present invention provides a high qualityredistribution metal layer in an integrated circuit chip by fabricatingthe redistribution metal layer during the original fabrication of thebasic functional chip.

FIG. 1 illustrates a portion of a typical prior art integrated circuitchip 100. The features of prior art integrated circuit chip 100 havebeen previously discussed.

FIG. 2 illustrates an advantageous embodiment of an integrated circuitchip 200 of the present invention. Active circuit area 210 of integratedcircuit chip 200 is fabricated by sequentially depositing layers ofthree metals (represented by the letters M1, M2 and M3) on a basesubstrate 220. An associated metal pad 230 is also fabricated as shownin FIG. 2. Active circuit area 210 and metal pad 230 are covered withlayer 240 of undoped silicon oxide (USG). USG layer 240 is then coveredwith a layer 250 of phosphorus doped silicon oxide (PSG).

Redistribution metal layer 260 is then placed over PSG layer 250 asshown in FIG. 2. A first end portion of redistribution metal layer 260is then electrically connected to metal pad 230. In one advantageousembodiment the metal in redistribution metal layer 260 is aluminum. Inanother advantageous embodiment the metal in redistribution metal layer260 is tungsten. Other types of metals may also be used.

A layer 270 of silicon oxynitride (SiON) is then deposited overredistribution metal layer 260. A layer 280 of polyimide is thendeposited over silicon oxynitride (SiON) layer 270. Portions ofpolyimide layer 280 and silicon oxynitride (SiON) layer 270 are thenetched to fit a desired pattern that leaves portions of redistributionmetal layer 260 uncovered. Redistribution metal layer 260 follows theunderlying contours of the phosphorus doped silicon oxide (PSG) layer250. A substantial portion of redistribution metal layer 250 may be flatto receive a solder bump.

Integrated circuit chip 200 of the present invention therefore comprisesredistribution metal layer 260 having a first portion in electricalcontact with metal pad 230 and having a flat second portion open toreceive a solder bump (solder bump not shown in FIG. 2). The quality offabrication of redistribution metal layer 260 is of the same highquality as the other metal layers of integrated circuit chip 200. Thestructure of integrated circuit chip 200 comprising redistribution metallayer 260 may be achieved with only two additional process steps. Thesystem and method of the present invention therefore provides a low costsimplified method for fabricating a redistribution metal layer in anintegrated circuit chip.

FIG. 3 illustrates an alternate advantageous embodiment of an integratedcircuit chip 300 of the present invention. Active circuit area 310 ofintegrated circuit chip 300 is fabricated by sequentially depositinglayers of three metals (represented by the letters M1, M2 and M3) on abase substrate 320. An associated metal pad 330 is also fabricated asshown in FIG. 3. Plug 340 of redistribution metal layer is mounted onand electrically connected to metal pad 330. Plug 340 of redistributionmetal layer extends upwardly from metal pad 330 as shown in FIG. 3.

Active circuit area 310 and metal pad 330 are covered with layer 350 ofundoped silicon oxide (USG). USG layer 350 is then covered with a layer360 of phosphorus doped silicon oxide (PSG). A layer 370 of siliconoxynitride (SiON) is then deposited over PSG layer 360.

A layer 380 of redistribution metal layer is then deposited over layer370 of silicon oxynitride (SiON). Layer 380 of redistribution metallayer is electrically connected to the top of plug 340 of redistributionmetal layer. In this manner plug 340 and layer 380 form a continuouselectrical path from metal pad 330 to the surface of layer 380. In oneadvantageous embodiment the metal in redistribution metal layer 380 isaluminum. In another advantageous embodiment the metal in redistributionmetal layer 380 is tungsten. Other types of metals may also be used.

Lastly, a polyimide layer 390 is deposited over portions ofredistribution metal layer 380 and over portions of silicon oxynitride(SiON) layer 370. Portions of polyimide layer 390 are then etched to fita desired pattern that leaves portions of redistribution metal layer 380uncovered. Redistribution metal layer 380 follows the underlyingcontours of the silicon oxynitride (SiON) layer 370. As shown in FIG. 3,a substantial portion of silicon oxynitride (SiON) layer 370 andredistribution metal layer 380 may be flat to receive a solder bump. Theplanar surfaces of the silicon oxynitride (SiON) layer 370 and of theredistribution metal layer 380 may be fabricated by polishing thesurfaces with chemical mechanical polishing (CMP) after metal depositionand patterning.

Integrated circuit chip 300 of the present invention therefore comprisesa redistribution metal layer comprising a redistribution metal layerplug 340 and a redistribution metal layer 380. The redistribution metallayer of this embodiment of the invention comprises a first portion inelectrical contact with metal pad 330 (i.e., plug 340) and a secondportion (i.e., layer 380) open to receive a solder bump (solder bump notshown in FIG. 3). The quality of fabrication of the combination of plug340 and layer 380 of the redistribution metal layer is of the same highquality as the other metal layers of integrated circuit chip 300.

The planar structure of redistribution metal layer 380 within integratedcircuit chip 300 offers an advantageous environment for the placement of“under bump metallurgy” and for the placement of a solder bump. Theplanar structure of redistribution metal layer 380 within integratedcircuit chip 300 also makes possible the use of simplified “under bumpmetallurgy” of copper damascene. The system and method of the presentinvention therefore provides a low cost simplified method forfabricating a planar structure of a redistribution metal layer in anintegrated circuit chip.

FIG. 4 illustrates a flow chart of an advantageous embodiment of amethod of the present invention for providing a redistribution metallayer in an integrated circuit chip. The steps of the method aregenerally denoted with reference numeral 400.

The first step is to fabricate an active circuit area 210 and anassociated metal pad 230 on a base substrate 220 (step 410). Then activecircuit area 210 and metal pad 230 are covered with USG layer 240 andUSG layer 240 is covered with PSG layer 250 (step 420). Thenredistribution metal layer 260 is deposited over PSG layer 250 (step430).

Redistribution metal layer 260 is electrically connected to metal pad230 (step 440). Silicon oxynitride (SiON) layer 270 is then depositedover redistribution metal layer 260 (step 450). Polyimide layer 280 isthen deposited over silicon oxynitride (SiON) layer 270 (step 460).Lastly, portions of polyimide layer 280 and silicon oxynitride (SiON)layer 270 are etched to fit a desired pattern that leaves portions ofredistribution metal layer 380 uncovered to receive a solder bump (step470).

FIG. 5 illustrates a first stage of construction of an alternateadvantageous embodiment of an integrated circuit chip 500 of the presentinvention. Active circuit area 510 of integrated circuit chip 500 isfabricated on a base substrate 520. An associated metal pad 530 is alsofabricated as shown in FIG. 5. Then active circuit area 510 and metalpad 530 are covered with passivation layer 540. For clarity passivationlayer 540 in FIG. 5 is shown as a single layer. Passivation layer 540may actually comprise a number of layers as in the case of integratedcircuit chip 200 and integrated circuit chip 300.

Vias 550, 560 and 570 are etched through passivation layer 540 using aconventional etch process. Vias 550, 560 and 570 extend throughpassivation layer 540 to metal pad 530. For clarity FIG. 5 is not drawnto scale. The vertical dimension is exaggerated so that the height ofthe elements of integrated circuit chip 500 (and the height of vias 550,560 and 570) appears to be greater than normal with respect to thehorizontal dimension.

FIG. 6 illustrates a second stage of construction of an alternateadvantageous embodiment 500 of an integrated circuit chip 500 of thepresent invention. After vias 550, 560 and 570 have been etched throughthe body of passivation layer 540, the surface of passivation layer 540is etched to form a pattern for a redistribution metal layer. As shownin FIG. 6, portions of the surface of passivation layer 540 may beremoved to form topological features such as a trench. The trench shownin FIG. 6 is located at the point where vias 550, 560 and 570 extendthrough passivation layer 540. This particular location for the trenchis merely an example. Other topological features of a redistributionmetal layer may be etched in passivation layer 540 at other locations.Dotted line 600 in FIG. 6 shows the location of the original surface ofpassivation layer 540 before portions of passivation layer 540 wereremoved.

FIG. 7 illustrates a third stage of construction of an alternateadvantageous embodiment of an integrated circuit chip 500 of the presentinvention. Redistribution metal layer 580 is formed on the surface ofintegrated circuit chip 500 by depositing metal into the trench patternsetched in passivation layer 540. In one advantageous embodiment themetal in redistribution metal layer 580 is aluminum. In anotheradvantageous embodiment the metal in redistribution metal layer 580 istungsten. Other types of metals may also be used.

When metal is deposited onto the trench pattern etched into the surfaceof passivation layer 540, a portion of the metal fills vias 550, 560 and570. The vias 550, 560 and 570 are completely filled with metal. Thisensures that there is an electrical contact between metal pad 530 andredistribution metal layer 580. Metal may be deposited into vias havingan aspect ratio as much as one to twenty (1:20). That is, metal maycompletely fill a via that is twenty times longer than it is wide.

The vias 550, 560 and 570 are simultaneously filled with metal duringthe metal deposition process that fills the trench pattern etched intopassivation layer 540. This fact is very important because it combinestwo steps into a single step. This eliminates the trouble and expense ofan additional process step. In particular, in this advantageousembodiment of the invention, there is no need to fill vias 550, 560 and570 with metal in a first step and then connect the filled vias 550, 560and 570 with the redistribution metal layer 580 in a second step. Thevias 550, 560 and 570 and the redistribution metal layer 580 aresimultaneously created as a unitary structure.

After redistribution metal layer 580 has been formed within the metalpattern etched into passivation layer 540, a chemical mechanicalpolishing (CMP) process is applied to the surface of redistributionmetal layer 580. The CMP process produces a flat polished metal surfacethat is suitable for receiving a solder bump or other interface layersthat are compatible with solder.

Dotted line 600 in FIG. 7 shows the location of the original surface ofpassivation layer 540 before portions of passivation layer 540 wereremoved. In the embodiment of the invention shown in FIG. 7 the surfaceof the redistribution metal layer 580 is lower than the original surfaceof passivation layer 540 that existed before portions of passivationlayer 540 were removed.

FIG. 8 illustrates a flow chart of an advantageous embodiment of amethod of the present invention for providing a redistribution metallayer in an integrated circuit chip. The steps of the method aregenerally denoted with reference numeral 800.

The first step is to fabricate an active circuit area 510 and anassociated metal pad 530 on a base substrate 520 (step 810). The nextstep is to cover active circuit area 510 and metal pad 530 withpassivation layer 540 (step 820). Then vias 550, 560 and 570 are etchedthrough passivation layer 540 to metal pad 530 (step 830).

Then a metal pattern for the redistribution metal layer is etched intopassivation layer (step 840). The next step is to deposit metal over themetal pattern in passivation layer 540. As previously described, themetal simultaneously fills vias 550, 560 and 570 (step 850). Lastly, achemical mechanical polishing (CMP) process is applied to produce a flatpolished surface in redistribution metal layer 580.

During the fabrication of an integrated circuit chip several layers ofmetal may be used to fashion the active circuitry area of the chip. Forexample, integrated circuit chip 200 has an active circuit area 210comprising layers of three metals (represented by the letters M1, M2 andM3) on a base substrate 220. Integrated circuit chip 300 has the samestructure.

In an advantageous embodiment of the present invention, the last metallayer used to fabricate an active circuit area may also be used tofabricate the redistribution metal layer in the integrated circuit chip.For example, if there are five (5) metal layers used to fabricate anactive circuit area, then the fifth metal layer may also be used tofabricate the redistribution metal layer. The redistribution metal layermay be connected to the active circuit area through multiple viasinstead of through a large metal pad. Manufacturing time and expense canbe saved by using a single metal layer to perform the function of aredistribution metal layer and the function of an active circuit. Inthis advantageous embodiment of the invention there is no need to add aseparate metal layer for the redistribution metal layer. There is toneed to perform a separate manufacturing step to add the redistributionmetal layer.

FIG. 9 illustrates an advantageous embodiment of an integrated circuitchip 900 of the present invention. Active circuit area 920 and activecircuit area 925 are placed on base substrate 910. Active circuit area920 and active circuit area 925 are made up of a first metal layer.Substrate layer 915 and substrate layer 930 are then applied to coverthe first metal layer of active circuit area 920 and active circuit area925.

An active circuit area 940 and an active circuit area 945 are thenplaced on substrate 930. Active circuit area 940 and active circuit area945 are made up of a second metal layer. Substrate layer 935 andsubstrate layer 950 are then applied to cover the second metal layer ofactive circuit area 940 and active circuit area 945.

Vias to active circuit area 940 (collectively designated with referencenumeral 955) and vias 960 to active circuit area 945 (collectivelydesignated with reference numeral 960) are etched in substrate layer 950and filled with a third metal layer. As shown in FIG. 9, the third metallayer within vias 955 is coupled to a bump pad 970 in top substratelayer 965. Bump pad 970 is also made of the third metal layer.

The third metal layer within vias 960 is coupled to individual activecircuit elements 975 on top substrate layer 965. The individual activecircuit elements 975 are also made of the third metal layer. Bump pad980 on top substrate layer 965 is also made up of the third metal layer.Bump pad 980 may be connected to other active circuit elements (notshown) within integrated circuit 900. The third metal layer inintegrated circuit chip 900 is the last metal layer in integratedcircuit chip 900.

The last metal layer (here, the third metal layer comprising bump pad970, individual active circuit elements 975, bump pad 980, vias 955 andvias 960) may be formed using a metal that is different than the metalused in the previous metal layers. The metal in the last metal layer iscompatible with solder (e.g., copper, nickel, palladium) in order toreceive solder on the solder bumps formed in the last metal layer.

FIG. 9 illustrates how the last metal layer in an integrated circuit maybe used to fabricate both active circuit elements and one or more bumppads for solder bumps.

Although the present invention has been described in detail, thoseskilled in the art will understand that various changes, substitutions,and alterations herein may be made without departing from the spirit andscope of the invention it its broadest form.

1. A method for fabricating an integrated circuit comprising:fabricating a first portion of an active circuit area and an associatedmetal pad on a base substrate; depositing a passivation layer above thefirst portion of the active circuit area and above the metal pad,wherein at least portions of an upper surface of the passivation layeris non-planar; etching at least one via through the passivation layer tothe metal pad; etching a metal layer pattern into the passivation layer;and depositing a metal layer onto the metal layer pattern in thepassivation layer and in the via connected to the metal pad to form aredistribution metal layer, wherein a portion of the redistributionmetal layer forms a solder bump pad.
 2. The method as claimed in claim 1further comprising: polishing a surface of the redistribution metallayer to produce a flat surface on the redistribution metal layer. 3.The method as claimed in claim 1 further comprising: depositing themetal layer into at least one via to electrically connect the metal padto the solder bump pad portion of the redistribution metal layer.
 4. Amethod for fabricating an integrated circuit, comprising: forming atleast one active circuit area within the integrate circuit; forming aninsulating layer having a contact opening to an active circuit elementand a variable and non-planar upper surface between the contact openingand a solder bump contact region laterally spaced apart from the contactopening; and forming a redistribution metal layer in the integratedcircuit over and conformal to the variable and non-planar upper surface,the redistribution metal layer coupling the active circuit element tothe solder bump contact region.
 5. The method of claim 4, whereinportions of the redistribution metal layer in the solder bump contactregion are left open by overlying material to receive a solder bump. 6.The method of claim 4, wherein the portions of the redistribution metallayer in the integrated circuit that are open to receive a solder bumpinclude at least one flat surface, the method further comprising:attaching a solder bump to the flat surface of the redistribution metallayer.
 7. The method of claim 4, further comprising: attaching a solderbump to the portions of the redistribution metal layer of the integratedcircuit that are open to receive a solder bump.
 8. The method of claim4, further comprising: forming the at least one active circuit area andan associated metal pad on a base substrate; forming a silicon oxidelayer above the at least one active circuit area and above the metalpad; forming a phosphosilicate glass layer above the silicon oxidelayer; forming the redistribution metal layer above the phosphosilicateglass layer, wherein the redistribution metal layer is electricallyconnected to the metal pad; and forming a silicon oxynitride layer overportions of the redistribution metal layer.
 9. The method of claim 8,wherein portions of the redistribution metal layer are open to receive asolder bump.
 10. The method of claim 8, further comprising: formingopenings through the silicon oxynitride layer deposited above theredistribution metal layer etched to a pattern that leaves portions ofthe redistribution metal layer uncovered to receive a solder bump. 11.The method of claim 8, further comprising: forming a polyimide layerabove portions of the redistribution metal layer and above portions ofthe silicon oxynitride layer, wherein portions of the redistributionmetal layer are open to receive a solder bump.
 12. The method of claim8, further comprising: attaching a solder bump to the portions of theflat redistribution metal layer of the integrated circuit that are opento receive a solder bump.
 13. The method of claim 4, wherein theredistribution metal layer is above all other metal layers within anactive circuit area of the integrated circuit except any solder bumps.14. The method of claim 4, further comprising: forming a siliconoxynitride layer above the redistribution metal layer; and forming apolyimide layer above the silicon oxynitride layer.
 15. The method ofclaim 14, further comprising: etching an opening through the siliconoxynitride layer and the polyimide layer.
 16. A method for fabricatingan integrated circuit, comprising: forming at least one active circuitarea within the integrate circuit; forming a passivation layer above theat least one active circuit area, the passivation layer having a contactopening to an active circuit element and a solder bump contact regionlaterally spaced apart from the contact opening, the passivation layerhaving a variable and non-planar upper surface within at least a portionof the region between the contact opening and the solder bump contactregion; and forming a redistribution metal layer in the integratedcircuit over and conformal to an upper surface of the passivation layer,the redistribution metal layer coupling the active circuit element tothe solder bump contact region.
 17. The method of claim 16, whereinportions of the redistribution metal layer in the solder bump contactregion are left open by overlying material to receive the solder bump.18. The method of claim 16, wherein the portions of the redistributionmetal layer in the integrated circuit that are open to receive a solderbump include at least one flat surface, the method further comprising:attaching a solder bump to the flat surface of the redistribution metallayer.
 19. The method of claim 16, further comprising: attaching asolder bump to the portions of the redistribution metal layer of theintegrated circuit that are open to receive a solder bump.
 20. Themethod of claim 16, further comprising: forming the at least one activecircuit area and an associated metal pad on a base substrate; forming asilicon oxide layer above the active circuit area and above the metalpad; forming a phosphosilicate glass layer above the silicon oxidelayer; forming the redistribution metal layer above the phosphosilicateglass layer, wherein the redistribution metal layer is electricallyconnected to the metal pad; and forming a silicon oxynitride layer aboveportions of the redistribution metal layer.